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Conductive hotmelt adhesives
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The application of hotmelt products requires low viscosity that is vital for optimum processing, and a low modulus garanteeing adhesive properties.
Both these essential characteristics are extremely difficult to retain when electrical conductivity is also required.
In particular, the conductive fillers traditionally used do not offer a feasible technical solution as they lead to a considerable increase in the modulus which then severely affects the adhesive properties.
Arkema has now revisited this application, and has obtained results in its laboratories that show that it is entirely possible to achieve the required compromise between viscosity, adhesion and conductivity by using small amounts of its
Graphistrength® multiwall carbon nanotubes perfectly dispersed in a suitable thermoplastic matrix such as a copolyamide from the
Platamid series.
